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Direct method to etch-embed Ce onto Cu-based Oxide

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Trisha Lewis
Jun 19, 2019 14:34
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In a paper to be published in the forthcoming issue in NANO, a team of researchers from Nanchang University have attempted to directly engineer the surface structure of Cu-based substrate to get a series of Ce-O-Cu catalysts for NH3-SCR of NO.

The obtained catalysts were structured as CuO matrix with interactive surface composed by Cu(I)-Cu(II) and Ce(III)-Ce(IV) co-present species, exhibiting the distinct synergistic effect and leading to attractive catalytic performance even with SO2 present in reactant mixture.

Here, an attempt to directly construct and manipulate Ce-O-Cu composited surface structures from the design of Ce(IV) to chemically embed Ce into the surface of Cu2O substrate was made, and the thermally-derived samples were investigated as catalysts for NH3 selective catalytic reduction (NH3-SCR) of NO.

The feature of surface structure of solid catalyst such as oxide composites was the decisive factor to govern the performance for heterogeneous catalysis reactions.

Unlike these body-mingling preparations from traditional methods, in this work, an attempt to directly construct and manipulate composited oxide surface upon a redox replacement preparation was made by employing Ce(IV) precursor to etch Cu2O in order to embed Ce species onto Cu-based oxide surface, and the catalysts derived from thermal stabilization treatments were investigated for NH3-SCR of NO.

In principle, the standard potentials for two redox pairs [Ce(IV)/Ce(III)] and [Cu2O/Cu2+] were 1.72 V and 0.20 V, respectively, the lower potential of [Cu2O/Cu2+] pair means Cu2O would act as the reductant when it encountered the Ce(IV) species, i.e., Ce(IV) species could etch Cu2O to produce Cu2+ and Ce(III) species.

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Trisha Lewis
Jun 19, 2019 14:34
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