Global IC Packaging Market was valued at USD 78.18 billion in 2021, and it is expected to reach a value of USD 147.57 billion by 2028, at a CAGR of more than 9.50% over the forecast period (2022 - 2028).
The IC packaging protects IC chips from the environment and ensures a secure electrical connection for chip mounting on printed circuit boards. The rapid advancement of electronics technology, such as AI and cloud computing, is complemented by a high demand for high-speed, high-integration, and low-power ICs. During the last stages of the semiconductor manufacturing process, it is a supporting case that protects silicon wafers, logic units, and memory from physical damage and corrosion. It makes it possible to connect the chip to a circuit board. Various ICs have different packaging needs, resulting in IC Packaging market growth prospects.
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Top Player's Company Profiles
- SPIL (China)
- Powertech Technology Inc. (China)
- TongFu Microelectronics Co. Ltd. (China)
- Lingsen Precision Industry Co. Ltd. (China)
- Sigurd Corporation (China)
- Greatek Electronics Inc. (China)
- OSE Corp. (China)
- Tianshui Huatian Technology Co. Ltd. (China)
- UTAC Holdings Ltd. (Singapore)
- King Yuan Electrics Co. Ltd. (China)
- ChipMOS Technologies Inc. (China)
- FATC (China)
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Recent Developments
- In June 2022, Advanced Semiconductor Engineering, Inc. (ASE), introduced VI Pack™, an advanced packaging platform designed to enable vertically integrated package solutions. VI Pack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance.
- In June 2022, Tera View is announced the release of the EOTPR 4500, a purpose-built integrated circuit package inspection machine. The auto prober technology of the EOTPR 4500 was created to tackle the demands of the most modern IC packaging technology by accepting substrate sizes up to 150mmx150mm while maintaining probe tip placement precision of +/- 0.5m.
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