The global bonding sheet market size is projected to grow from USD 386 million in 2022 to USD 551 million by 2027, at a CAGR of 7.4% between 2022 and 2027. Emerging economies of Asia Pacific and Europe are expected to witness rising demand of bonding sheet owing to the developing electronics industry and applications in flexible printed circuit board (FPCs) and multi-layer FPCs. Additionally, rising demand for consumer electronics, electric vehicles, and miniaturization of electronic components are the major driver for the growth of bonding sheet market. Advancement in telecommunication such as 5G technology is also expected to increase the demand of bonding sheet for during the forecast period. However, geopolitical uncertainties, and high capital investment hinders the growth of the market.
Bonding sheet is an adhesive film or sheet which consist of an adhesive layer on one side for bonding or surface coating. It has a removable paper based release liner to protect the adhesive sheet from premature adhesion. Bonding sheet are primarily used in electronics application such as bonding of flexible inner layers or rigid cap layers in multi-layer laminations, fabrication of rigid--flex PCBs, and others such as heat sinks or stiffeners.
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Based on adhesive material, polyimide bonding sheet is estimated to be the fastest growing market, during the forecast period. Polyimide bonding sheet have superior mechanical and thermal properties compared to other polymers. Moreover, rising demand from automotive and electronics application is expected to propel the growth of polyimide adhesive material during the forecast period.
Based on adhesive thickness, 25µm (1mil) segment accounted for the largest market share in 2021 owing to its flow properties and strong adhesion. Rising production of multi-layer FPCs for electronics application is also expected to drive the demand for 25µm (1mil) bonding sheet. This type of bonding sheet replaces low-melting point liquid crystalline polymer (LCP) bond plies and laminates.
Based on application, electronics/optoelectronics segment is estimated to be the fastest growing market. Bonding sheet are used in demanding applications in electronics such as fixing CPUs to heat sinks or heat radiation fans, LED modules, and others such as bonding chips and base cards of small memory cards. Moreover, bonding sheet have various properties such as thermal resistance, dielectric constant, flame retardancy, and others which makes them ideal material for bonding application in electronics/optoelectronics segment.
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Asia Pacific region is the fastest-growing market for bonding sheets driven by rising demand from emerging economies such as China and India. Government regulation and incentives schemes, low labor cost, and availability of raw materials are some of the factors driving the market. Japan, China, and India are the key market of bonding sheet in Asia Pacific.
The major players in the bonding sheet market include Arisawa Manufacturing Co. (Japan), DuPont (US), NIKKAN INDUSTRIES Co., Ltd. (Japan), Dexerials Corporation (Japan), Nitto Denko Corporation (Japan), Showa Denko Materials Co., Ltd. (Japan), Toray Industries, Inc. (Japan), NAMICS Corporation (Japan), and Shin-Etsu Polymer Co., Ltd. (Japan). These players have adopted various growth strategies to expand their presence in the market. New product launch, and investment & expansion have been the leading strategies adopted by the major players in the last five years to strengthen their competitiveness and broaden their customer base in the global bonding sheet market.
Arisawa Manufacturing Co., Ltd. is one of the leading players in the field of electronic/optoelectronic materials. The company manufactures cover lays, laminates, adhesive sheets, and other electronics materials. It offers bonding sheet adhesives under the brand interlayer adhesive sheet through the electronics related materials business segment. Arisawa Manufacturing Co., Ltd. provides bonding sheet primarily for FPC applications under the FPC materials product portfolio for electronics and telecommunication applications.
Nitto Denko Corporation develops core technologies for adhesive based products and manufactures bonding sheets, insulating materials, automotive electronics, and other electronics products. It offers bonding sheet under the brand FB-ML4 through the Industrial Tape business segment. Nitto Denko Corporation manufactures acrylic and polyester bonding sheet ideal for electronics/optoelectronics, home appliances, LED substrate, and other applications. The company has manufacturing facilities in Japan and other Asia Pacific countries such as China, Thailand, Korea, and others.
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Another important player in the bonding sheet market is DuPont (US) is a prominent bonding sheet manufacturing company engaged in R&D, manufacturing, processing, marketing, and supplying of bonding sheet. Its product portfolio includes Pyralux brand of bonding sheet in various grades and adhesive thickness for electronics, telecommunication, automotive, and other applications. The company has a global business presence with manufacturing location and sales offices in Asia Pacific, Europe, North America, South America, and the Middle East & Africa.
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The global Bonding Sheet Market research report, published by Value Market Research, is designed to offer various market framework such as market size, portion, trends, growth path, value and factors that impact the current market dynamics over the forecast period 2020-2027.
Most importantly, this report also provides the latest significant strategies adopted by major players along with their market share.The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide.
Fuller Company, Ashland Inc., Dymax Corporation, 3M, Permabond, Industrial Specialties Mfg.
This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.Get more information on "Global Bonding Sheet Market Research Report" by requesting FREE Sample Copy at https://www.valuemarketresearch.com/contact/bonding-sheet-market/download-sampleMarket DynamicsThe global bonding sheet market is projected to grow at a considerable rate during the forecast period.
With the emergence of new advanced technology, electronic industries have shifted to flexible circuits to fulfill challenging form-factor requirements, eliminate connectors and improve performance, which has caused increased use of bonding sheets.
However, volatile raw material prices and environmental regulation is hindering the global market growth.The report covers Porter’s Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis.
The newly added Bonding Film market research report by Value Market Research disclose all the important information associated with the market such as value, growth factor, trends, market share, size, and challenges for the forecasted timeline 2020-2027.
Further, this report also highlights smart strategy adopted by major players and also their market share.
Basically, this report is designed to give a proper understanding of industry structure and competition intensity attractiveness.The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide.
The major players in the bonding film market include Henkel AG & Co. KGaA, 3M, Cytec Solvay Group, Hitachi Chemical Co., Ltd., Arkema S.A., H.B.
This section includes a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.Get more information on "Global Bonding Film Market Research Report" by requesting FREE Sample Copy at https://www.valuemarketresearch.com/contact/bonding-film-market/download-sampleMarket DynamicsBonding films are widely used in various industrial verticals due to their high-strength and fast bonding properties.
Further, more rising demand in semi-conductors, smart clothes, and smart-wearable gadgets is boosting the market.
