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Advancements in smartphones, tablets, earphones/headphones, and wearables are expected to fuel the growth of the market for consumer electronics, which use SOI wafers.

Moreover, the rising adoption of SOI-based devices in advanced applications such as autonomous cars is also creating growth opportunities for the SOI market.Effective use of silicon during the manufacturing of thin SOI wafers and low operating voltage and high performance of SOI-based devices are some of the factors expected to contribute to the growth of the SOI market across the globe.

The flourishing Integrated Circuit (IC) industry, expanding SOI ecosystem in Asia Pacific, and increasing use of SOI in IoT applications act as growth opportunities for the SOI market during the forecast period.Download PDF Brochure Copy:https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=158The SOI market for 300 mm wafer size is expected to grow at a higher CAGR than the market for 200 mm and less than 200 mm wafer size during the forecast period.

For instance, in June 2018, TowerJazz (Israel) announced the expansion of RF-SOI 65 nm process in its 300 mm Uozu, Japan fab.The RF-SOI wafer type segment accounted for the largest share of the SOI market in 2018.

For data transmission over 2G, 3G, and 4G/ Long-term Evolution (LTE), mobile devices require dedicated Front-end Modules (FEMs).

These FEMs use RF-SOI chips, which integrate switches, power amplifiers, antenna tuning components, power management units, and filters on a single platform.

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Advancements in smartphones, tablets, earphones/headphones, and wearables are expected to fuel the growth of the market for consumer electronics, which use SOI wafers.

Effective use of silicon during the manufacturing of thin SOI wafers and low operating voltage and high performance of SOI-based devices are some of the factors expected to contribute to the growth of the SOI market across the globe.

Download PDF Brochure Copy:https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=158 The SOI market for 300 mm wafer size is expected to grow at a higher CAGR than the market for 200 mm and less than 200 mm wafer size during the forecast period.

For instance, in June 2018, TowerJazz (Israel) announced the expansion of RF-SOI 65 nm process in its 300 mm Uozu, Japan fab.

For data transmission over 2G, 3G, and 4G/ Long-term Evolution (LTE), mobile devices require dedicated Front-end Modules (FEMs).

These FEMs use RF-SOI chips, which integrate switches, power amplifiers, antenna tuning components, power management units, and filters on a single platform.

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