Laser cutting, as well as laser fine cutting, are applied to various material types where complex contours require precise, quick, and force-free processing. Lasers create narrow kerfs and achieve high precision cuts in this method. This method shows no distortion, and in many cases, post-processing is not necessary as the component is subject to only a small amount of heat input and can be cut mostly dross-free. Nearly all kinds of metals can be cut by laser: the most common applications are silicon, mild steel, stainless steel, and aluminum. Other parts cut by laser are made of wood, plastics, glass, and ceramics. Laser cutting is already cost-effective for small-batch production compared with alternative techniques such as die-cutting. Localized input of laser energy providing small focal diameters, small kerf widths, high feed rate, and minimal heat input is the significant advantage of laser cutting.
In addition to metals, a wide range of other items, including semiconductors, plastics, organic materials, ceramics, paper, graphite, diamonds, and composite materials, can be cut with the laser. With very high precision and low heat input, mono and poly-crystalline silicon wafers can be cut at high speeds using the same ablation process as for edge isolation and drilling.
Why Choose Laserod for Processing Silicon?
Laserod specializes in laser machining of silicon (Si). We offer precision laser cutting, scribing, coring (resizing), flat or notch cutting, micro-drilling holes, singulation, and dicing of silicon and MEMS devices.
Typically applications of laser machining silicon include the manufacture of MEMS devices, sensors, detectors, and solar cells.
• Our laser’s kerf loss is typically 30 microns with 10um optional. The laser cutting edge stays sharp – improving yield, and the cutting edge suffers no wear and tear.
• We work to low tolerances and very fine cuts.
• Tolerances in our laser working of silicon run a few microns, with the fineness of our laser cuts down to 10 microns.
• High power, high precision gives better results.
• High laser power at a favorable wavelength focused on a small spot, and the beam controlled by top precision mechanics gives superior results in coring, cutting, scribing channels, dicing, and hole drilling of silicon.
If you have a unique project or questions to see if Laserod can help log on to our website www.laserod.com or contact one of our experts at 310-340-1343.
