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An Overview of the Silicon Carbide SiC Wafer Market

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emmadobie

The report provides an overview of the Silicon Carbide SiC Wafer Market. This report aims to provide a comprehensive analysis of the market by examining its drivers, restraints, opportunities, and costs. The report also provides information on the company profiles, raw materials, downstream demand, and manufacturing process. It also includes analysis of government policies and macroeconomic factors to assess the market's prospects. This report is essential reading for anyone looking to invest in the Silicon Carbide SiC Wafer market.


Applications


The applications of silicon carbide in semiconductors are growing rapidly. While silicon is the most commonly used semiconductor, its limitations are limiting its use in high-power applications. Silicon carbide is characterized by a high bandgap, which is a measure of the energy gap between the two materials. With a bandgap of 3.26 eV, silicon carbide has the high energy gap needed for high-speed, low-power electronic devices.

The manufacturing process for producing SiC wafers involves a reclaim process, whereby a damaged surface layer is removed from the wafer and repolished to create a device-ready surface. Because the process is labor-intensive and costly, reclaims are not a viable option for final solutions, but the industry must adapt to it if it wants to benefit from this advanced semiconductor material.


According to DataIntelo, the silicon carbide sic wafer market is expected to grow at a substantial growth rate. Another application for silicon carbide is in the electric vehicle industry. In EVs, silicon IGBTs are used in the inverters to drive the electric motors. However, silicon is inefficient due to its high resistivity. By contrast, silicon carbide is nearly ten times more efficient and can handle the same load design requirements in smaller sizes. Silicon carbide can also improve the efficiency of the inverter system by nearly 80%.

The advantages of silicon carbide wafer are numerous. Its excellent electrical and thermal properties make it the ideal material for a wide range of electronics, including power conversion. Further, silicon carbide wafers have low cost, making them ideal for power semiconductor devices. If you are in the semiconductor industry and need a large supply of silicon wafers, this material can be the perfect solution. Its price and volume are attractive to chipmakers, which means SIC wafers are more cost-effective for them.


Characteristics


The silicon carbide semiconductor is made of high purity SiC crystals in a single disc, known as a silicon carbide wafer. These wafers are typically 100 mm or 150 mm in diameter and are primarily used in high-power electronics. Silicon carbide wafers are also made through epitaxial crystalline growth, which involves adding layers of single silicon carbide crystals to a substrate. This process is known as n-type epitaxy and requires accurate control of the material thickness.


Silicon carbide substrates are highly resistant to thermal shock, allowing them to rapidly change temperature without cracking. Silicon carbide is also extremely durable, with a much longer lifespan than bulk silicon. Additionally, silicon carbide does not react with alkalis, acids, or molten salts, making it a great choice for many applications. This allows silicon carbide substrates to outperform their silicon counterparts.

The difference between silicon carbide comes in the form of bandgap, the distance between atomic layers. Silicon's bandgap is around one eV, while silicon's is two and a half times larger. Because of this difference, silicon carbide is more dense and is therefore less conductive than silicon. Further, this material is also more expensive than its counterpart.


Achieved in 1893, silicon carbide is an ideal semiconductor material for power electronic components. Silicon carbide is available in various crystalline structures, including 3C, 4C, and 6H. Three C silicon carbide wafers are the most widely used, but other shapes may be available based on the atom configurations and doping levels. Acheson based his discovery on the fact that blue-black crystals are composed of a combination of carbon and corundum.


Manufacturing process


A silicon carbide (SiC) wafer is produced in 12 different steps. It starts with the production of siC boules, which resemble hockey pucks and are grown in ovens at half the temperature of the sun. The boules are then carefully sawed off to produce a single-crystal silicon carbide wafer. Unfortunately, the yield of these wafers is often low.

The manufacturing process of silicon carbide involves various steps that are essential for manufacturing a high-quality silicon carbide wafer. The first step is to prepare the silicon carbide powder and combine it with a binder. Next, it is processed by extrusion or cold isostatic pressing. The silicon carbide wafer is then sintered under high-temperature vacuum. This process imparts extreme hardness and ultimate corrosion resistance.

After the raw materials are prepared, they are mixed with a non-oxide binder to make a paste. After this, the paste can be compacted through cold isostatic pressing or extrusion. Extrusion involves forcing the mixture through a die that has an opening, and this produces silicon carbide tubes. The properties of silicon carbide tubes depend on the direction in which the process is performed.


The silicon carbide wafer is a high-performance semiconductor with excellent electrical and thermal properties. Its low specific on-resistance and high blocking voltage make it ideal for power and high-frequency applications. And it has no inherent defects that hinder it from becoming a power semiconductor. If you're in the market for a semiconductor wafer, don't miss the opportunity to get yours today.


Costs


The process used to develop silicon carbide (SiC) devices is similar to building integrated circuits on a silicon substrate. The costs of production are three to four times higher than those of the silicon counterpart. The reduction in cost is due in part to the shrinking size of wafers. From 2009 to 2012, the cost of a four-inch wafer dropped by half. The process also enables higher production rates and larger wafer diameters, and the resulting reduced manufacturing costs resulted in a higher sales volume of SiC devices.


The process for making silicon carbide semiconductors involves a variety of processes. The seed/wafer fabrication step includes crystal growth, outer diameter grinding, flat grinding, lapping, and polishing. As the wafer diameter grows, the process must be optimized. By reducing kerf loss, productivity increases. Multi-wire saws require diamond slurry for removal of subsurface damage. Laser-based slicing reduces overall material loss.

The cost of silicon carbide wafers also depends on the production process used for the semiconductor. Some companies use lasers to make these wafers, while others use thermal spraying techniques to form epilayers. In addition, the production process can be complex, so the cost of silicon carbide wafers can be high. However, the benefits of silicon carbide wafers far outweigh the costs.


In addition to the advantages of silicon carbide, the technology can also be used in power electronics. The increased demand for hybrid and plug-in hybrid cars is likely to fuel growth in the SiC market. In this way, the technology is not only more effective but more environmentally friendly. Therefore, it is a great choice for energy infrastructure. If you are considering making the switch, SiC is the perfect choice.


Market size


The Silicon Carbide SiC Wafer market is segmented by country, region, and application. Each of these segments can be further analyzed to provide an in-depth analysis of the market. According to the research, silicon carbide wafers are commonly used in LED lighting devices and power electronics switches. Hybrid electric vehicles are expected to drive demand for silicon carbide wafers. The Silicon Carbide SiC Wafer market is anticipated to grow at a CAGR of over 12% over the next few years.


The report includes regional sales of silicon carbide wafers in the U.S., Canada, and Mexico. It also covers the market in the Netherlands, Belgium, Switzerland, and the Rest of Europe. This research also analyzes business policies and trends. Companies across these regions are launching new products in the market to stay ahead of their competition. Silicon carbide is a versatile material, which is used in a variety of applications.


The Global Silicon Carbide SiC Wafer market is segmented by product type, such as discrete silicon carbide, bare die, and modules. Discrete silicon carbide wafers account for the largest revenue share in the market and is expected to maintain its dominance through the forecast period. This is driven by the increased demand for high-performance silicon carbide devices in power devices. Because of the material's ability to withstand high voltage, silicon carbide wafers offer higher switching speeds and voltage than conventional power devices. Furthermore, their smaller dimensions make them less expensive to manufacture, requiring less cooling.


The Silicon Carbide SiC Wafer market is currently divided into five regions, including North America, Europe, Asia Pacific, Middle East and Africa, Latin America, and the Rest of the World. The report also provides a competitive landscape with company profiles, financials, and market initiatives. Additionally, the report covers country-specific market shares and forecasts for these regions. These regional analyses provide a comprehensive overview of the Silicon Carbide SiC Wafer market.

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