5G networks represent a massive leap forward for cellular technology that will deliver speeds nearly 100 times faster than current 4G LTE networks. This groundbreaking increase in speed is made possible by new chipsets that support features like millimeter wave spectrum and massive MIMO. Millimeter wave spectrum in the 24-40 GHz range allows telcos to utilize high and intermediate frequency bands with lots of available channels to deliver multi-Gbps throughput. However, millimeter wave signals have shorter range and are more susceptible to obstruction than traditional cellular frequencies. This is where massive MIMO comes in, using multiple antennas at the base station to focus spectral efficiency in precise beamforming patterns that can overcome issues of blockage and propagation loss. The advanced digital signal processing capabilities of 5G chipsets enable the sophisticated beamforming algorithms required for massive MIMO. Dozens or even hundreds of transceiver paths must be coordinated simultaneously across an antenna array in real-time as the environment and user location changes. This level of coordination across wide bandwidths would not be possible without the dedicated silicon designed specifically for 5G. Millimeter wave and massive MIMO combined will allow 5G to scale capacities much higher than previous cellular generations through spatial multiplexing gains. Modem Chipsets Lead the Way Modem chipsets form the core infrastructure driving 5G Chipset networks, bridging the gap between radio frequencies and data processing. Leading modem chipset producers like Qualcomm, Intel, Huawei, Samsung and Mediatek are developing new system-on-chips specifically tailored for 5G NR specifications. These 5G modem SOC's integrate the RF transceiver, baseband modem, and surrounding multimedia and connectivity cores onto a single die. This level of integration enables the ultra-low latency, multi-Gbps throughput, and specialized radio access network functions required by 5G standards. Qualcomm in particular has taken an early lead with its Snapdragon X55 modem, the first to fully support non-standalone and standalone 5G NR modes on both sub-6GHz and millimeter wave frequencies. Key features of the X55 include support for downlink speeds up to 7Gbps using 5x carrier aggregation on up to 100MHz channel bandwidths. It also supports advanced features like hybrid beamforming and multi-SIM functionality. Rival modem vendors are working to match Qualcomm's capabilities, with Intel launching its 5G solutions in 2020 and Huawei and Samsung pushing to expand 5G adoption worldwide. As 5G networks expand, these modem chipset advancements will scale performance and deploy new applications. Enabling Massive IoT Connectivity In addition to powering high-speed mobile services, 5G chipsets are primed to support the billions of connected IoT devices coming online in the next decade. Low-power wide-area network (LPWAN) protocols developed for 5G like narrowband-IoT (NB-IoT) and LTE-M allow widespread deployment of cost-effective cellular modems optimized for sensors, meters, trackers and other small embedded systems. IoT chipsets intended for these protocols offer year-long battery life from small coin cells while maintaining reliable coverage even in deep indoor and remote locations. Leading 5G IoT chipset providers include Qualcomm, Sierra Wireless, Sequans, Telit and u-blox who offer both stand-alone LPWAN modems as well as integrated variants bundled with additional connectivity like Bluetooth and Wi-Fi. For example, the Telit FN980 5G IoT modem combines European and Asian band support for NB-IoT and LTE-M with integrated GNSS and a powerful applications processor. Such turnkey 5G IoT system-in-packages remove the complexity of meshing discrete components, speeding deployments of applications across utilities, logistics, infrastructure and more. As 5G networks densify globally through 2020's, the proliferation of low-cost cellular IoT endpoints enabled by new chipsets will unlock countless new industrial and consumer use cases. Evolution of Smartphone Silicon On the handset side, 5G brings new performance requirements that are driving smartphone SoC evolution. Existing mobile platforms from Qualcomm, Samsung, Huawei and others are adding dedicated 5G modems alongside faster CPUs and more sophisticated artificial intelligence processors. For example, Qualcomm's Snapdragon 865 platform pairs its powerful X55 5G modem with the company's third-gen AI engine and new Adreno 650 GPU. This combination allows for multi-gigabit throughput, on-device AI capabilities like real-time translation, and smooth handling of AR/VR applications. Leading phone OEMs are rapidly launching new flagship lines optimized for 5G using these system-on-chips. Devices like the Samsung Galaxy S20 Ultra, Huawei Mate 30 Pro and OnePlus 8 Pro all leverage the combined processing muscle of their respective platform vendors' first 5G-integrated SoCs to offer transformative new experiences requiring cutting-edge silicon. As these high-end models get customers comfortable with 5G connectivity, sustained innovation in 5G smartphone chipsets and components at lower price points from MediaTek and others will drive broader adoption through 2021 and beyond. The Future is Now Fueled by continuous advancement in 5G chipsets targeting everything from core network infrastructure to IoT endpoints to cutting-edge smartphones, the full vision of 5G's hyper-connected world is coming to life faster than previously imagined. Modem, transceiver and systems-on-chip innovators are unleashing the true powers of 5G technologies like millimeter wave, massive MIMO and mobile edge computing through dedicated silicon primed for both performance-hungry applications and large-scale industrial and consumer deployments. As these revolutionary 5G chipsets proliferate globally over the next year, we'll see 5G move from niche early adopter phase to delivering on its true widespread transformative promises. The future of ultra-fast, low latency connectivity is already here thanks to the silicon innovation driving 5G to new heights.
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Money Singh is a seasoned content writer with over four years of experience in the market research sector. Her expertise spans various industries, including food and beverages, biotechnology, chemical and materials, defense and aerospace, consumer goods, etc. (https://www.linkedin.com/in/money-singh-590844163)
