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Epoxy Chip Underfill adhesive
DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-chttps://www.deepmaterialcn.com/epoxy-based-chip-underfill.html
Arts and Crafts , Antiques Huizhou City, Guangdong,China
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